Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallizationALAM, M. O; CHAN, Y. C; TU, K. N et al.Chemistry of materials. 2003, Vol 15, Num 23, pp 4340-4342, issn 0897-4756, 3 p.Article

Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflowALAM, M. O; CHAN, Y. C; HUNG, K. C et al.Journal of electronic materials. 2002, Vol 31, Num 10, pp 1117-1121, issn 0361-5235, 5 p.Conference Paper

Effect of current stressing on the reliability of 63Sn37Pb solder jointsWU, B. Y; CHAN, Y. C; ZHONG, H. W et al.Journal of materials science. 2007, Vol 42, Num 17, pp 7415-7422, issn 0022-2461, 8 p.Article

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallizationZHONG, W. H; CHAN, Y. C; WU, B. Y et al.Journal of materials science. 2007, Vol 42, Num 13, pp 5239-5247, issn 0022-2461, 9 p.Article

Effect of bump characteristics and temperature variation on the online contact resistance of anisotropic conductive jointsALI, Lafir; CHAN, Y. C; ALAM, M. O et al.Journal of electronic materials. 2004, Vol 33, Num 9, pp 1028-1035, issn 0361-5235, 8 p.Article

Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current StressingWU, B. Y; ALAM, M. O; CHAN, Y. C et al.Journal of electronic materials. 2008, Vol 37, Num 4, pp 469-476, issn 0361-5235, 8 p.Article

Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current densityWU, B. Y; ZHONG, H. W; CHAN, Y. C et al.Journal of materials science. Materials in electronics. 2006, Vol 17, Num 11, pp 943-950, issn 0957-4522, 8 p.Article

A continuous contact resistance monitoring during the temperature ramp of anisotropic conductive adhesive film jointUDDIN, M. A; CHAN, Y. C; CHAN, H. P et al.Journal of electronic materials. 2004, Vol 33, Num 1, pp 14-21, issn 0361-5235, 8 p.Article

Curing kinetics of anisotropic conductive adhesive filmCHAN, Y. C; UDDIN, M. A; ALAM, M. O et al.Journal of electronic materials. 2003, Vol 32, Num 3, pp 131-136, issn 0361-5235, 6 p.Article

The effect of thermal cycling on the contact resistance of anisotropic conductive jointsALI, L; CHAN, Y. C; ALAM, M. O et al.Soldering & surface mount technology. 2005, Vol 17, Num 3, pp 20-31, issn 0954-0911, 12 p.Article

Modelling methodology for thermal analysis of hot solder dip process : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMSSTOYANOV, Stoyan; BAILEY, Chris; ALAM, M. O et al.Microelectronics and reliability. 2013, Vol 53, Num 8, pp 1055-1067, issn 0026-2714, 13 p.Conference Paper

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power deviceOTIABA, Kenny C; BHATTI, R. S; EKERE, N. N et al.Microelectronics and reliability. 2012, Vol 52, Num 7, pp 1409-1419, issn 0026-2714, 11 p.Article

Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder jointsZHONG, W. H; CHAN, Y. C; ALAM, M. O et al.Journal of alloys and compounds. 2006, Vol 414, Num 1-2, pp 123-130, issn 0925-8388, 8 p.Article

High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder jointsALAM, M. O; WU, B. Y; CHAN, Y. C et al.Acta materialia. 2006, Vol 54, Num 3, pp 613-621, issn 1359-6454, 9 p.Article

Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solderISLAM, R. A; WU, B. Y; ALAM, M. O et al.Journal of alloys and compounds. 2005, Vol 392, pp 149-158, issn 0925-8388, 10 p.Article